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Laser Welding Technology Application in Ceramic Substrate Industry

2025-03-18

In recent years, with the rapid development of electronic packaging, semiconductor manufacturing, and high-power electronic devices, ceramic substrates have become an essential material in high-end electronic manufacturing due to their excellent thermal conductivity, electrical insulation, and high-temperature resistance. As a high-precision, low-heat-impact advanced processing technology, laser welding is increasingly being applied in the ceramic substrate industry, providing significant support for industrial upgrading.


Principle of Laser Welding Technology


Laser welding utilizes a high-energy-density laser beam to act on the material surface, causing localized melting and forming a connection. Unlike traditional welding techniques, laser welding features non-contact processing, a minimal heat-affected zone, and high-precision control, making it particularly suitable for welding ceramics and metals. By optimizing laser parameters such as wavelength, pulse width, and energy density, the absorption rate of ceramic materials can be effectively improved, ensuring high-quality welding.



Extensive Application Scenarios


Currently, laser welding is widely used in the ceramic substrate industry, including electronic packaging, semiconductor manufacturing, high-power electronic devices, and sensors. For example, in power module packaging, laser welding is used to firmly bond copper layers to aluminum nitride (AlN) or silicon nitride (Si₃N₄) ceramic substrates, enhancing thermal conductivity and reliability. Additionally, high-end products such as MEMS sensors, RF microwave devices, and new energy vehicle power modules are increasingly adopting laser welding technology to improve durability and performance stability.


Technical Challenges and Breakthroughs


Despite its numerous advantages, laser welding in the ceramic substrate industry still faces some challenges. First, the significant difference in thermal expansion coefficients between ceramics and metals can lead to cracks or stress concentration at the welding interface. To address this, researchers have introduced transition layer materials (such as titanium and molybdenum) or optimized welding paths to reduce thermal stress. Second, ceramic materials have a low absorption rate of laser energy, making efficient bonding difficult with traditional welding methods. To improve welding quality, the industry is exploring the use of short-wavelength lasers (such as ultraviolet lasers) or pre-coated absorption layers.


With continuous technological advancements, laser welding is accelerating the transformation of the ceramic substrate industry toward high-end manufacturing. In the future, laser welding technology will play an increasingly important role in broader application scenarios, providing stronger momentum for the high-quality development of the ceramic substrate industry.


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